电镀的例句（电镀在句子中的用法）

• Single plated nickel barrier terminations has excellent solder heat resistance for soldering. 外部电极为镍的电镀构造,于焊接时具有极优越的耐热性.
• However, It'suffers from some problems such as tin whisker, surface color changes and bath mudding. 但纯锡电镀中存在着许多问题,如锡晶须 、 镀层变色及镀液混浊等.
• The most commonly used letterpress duplicate plates are stereotypes , electrotypes, plastic plates and rubber plates. 活版最常用的复制版有铅铸版、电镀版 、 塑胶版和橡胶版.
• This article electroplates aluminum on the substrate of 08 F steel and AZ 91 D magnesium alloy. 本文在08F钢和AZ91D镁合金上采用电镀铝的方法获得了铝镀层.
• Suitable for electroplated, vitrified and metal bond tools, wheels etc. 适用于电镀 、 瓷、属结合剂体系磨具 、 轮、具制造.
• Between electroplated layer and substrate level of electroplated sample is obviously stratified. 而电镀层与基体层之间有明显的分层现象.
• In electroplated metals, these defects are primarily dislocations, twins, and deposited foreign atoms or molecular groups. 对于电镀的金属来说, 这些缺陷主要是位错, 孪晶和其沉积的异类,原子或分子基因.
• The process of preparing diamond electrodeposited depressed saw blade was described. 介绍了电镀金刚石钹型锯片的生产工艺.
• The process does not require electrical current or anodes as in electroplating. 但是在电镀过程中不需要电流或阳极.
• A lot of sulfonated bodies applied in electroplating field were particularized. 列举了在电镀领域中实际应用到的各类磺化产物.
• To galvanize or plate ( metal ) by immersion. '电镀'.''通过浸泡镀涂金属.
• Galvanization means coating metal with zinc, or the act of stimulating action. 电镀是指给金属覆上一层锌, 或是一种刺激反应的作用.
• The surface can be treated with galvanization. 表面可电镀。
• Eletroplate the trash of the generation in industry and source detailed see a table 1. 电镀工业中产生的废物及污染源详见表1.
• Original plate: Relief printing plate produced bu 7 photomechanical etching as distinct from electrotyping. 原身版: 用照相晒版蚀刻方法造成的凸版.有别于电镀版.
• In printing, a duplicate letterpress plate made from an original by electroplating. 在印刷技术中, 一种用电镀方法从原版复制成的印刷版.
• Cloisonne - enameled in black, 24 k gold electroplate ( back is all gold ). 景泰蓝,搪瓷黑色, 24K金电镀 ( 背面是所有黄金 ).
• Electrolysis is also used to plate one metal on another. 电解也用于将一种金属电镀在另一种金属上.
• Cobalt - tungsten electrodeposit as copper barrier was presented in the paper. 本文提出以电镀钴钨二元合金镀层作为防铜渗层.
• Application: Mainly used in dry cell, electroplating, dye and precision casting, curriery, etchant, feed additive etc. 用途: 主要用于电池 、 电镀 、 染纺、精密铸造 、 鞣革 、 蚀刻剂 、 饲料添加剂等方面.