chip-off的例句（chip-off在句子中的用法）

• They chip in for the petrol and food. 他们凑钱买汽油和食物。
• This company pioneered the use of silicon chip. 这家公司开创了使用硅片的方法.
• A Control System of VVVF Elevator with Single Chip Microprocessor and PLC. PWM逆变器 型交流电梯紧急自动疏散系统.
• Objective To establish direct - write laser method for micromachining immunoassay microfluidic chip. 目的建立微流控芯片的CO_ 2激光直接微加工方法.
• Integrated circuit ( IC ): or microcircuit , or chip, or microchip. 集成电路: 亦称微电路 、 芯片或微芯.
• A control system on chip microprocessor is designed for submerged arc welder with magnetrol power source. 针对磁放大器式电源埋弧自动焊机设计了单片机控制系统.
• The class of single chip madine is very integrative and pracficas. 单片机是一门综合性和实践性很强的课程.
• This is the GaN LED chip and Yttrium Aluminum Garnet ( YAG ) package together cause. 这种LED是将GaN芯片和钇铝石榴石 ( YAG ) 封装在一起做成.
• Now, Mr Fukuda fils is proving a chip off the old block. 现在, “小”福田(福田康夫)也要“谨随父命”了.
• The chips are CY 7 C 64613 chip, EEPROM chip and RS 232 interface chip. 这三个芯片是CY7C64613芯片 、 EEPROM芯片和RS232接口芯片.
• DSS and SHS were designed for both software and chip implementations. DSS和SHS被设计成用软件和芯片两种方法实现.
• The kinetics of Au nanoparticles self - assembled on dithiol - modified gold chip was investigated. 研究表明,金纳米粒子自组装的动力学随着粒子的尺寸的变化而变化.
• Application of Chip Microcomputer in Miniature Air Desiccator. 单片机在小型空气干燥器中的应用.
• An all - digital QAM initial demodulator architecture is presented for HDTV receiver chip. 本文设计了一种适用于 高清晰 数字电视(HDTV)接收芯片的全数字正交幅度(QAM)解调器结构.
• Cyrix's PC - on - a - chip won't be the fastest computer around. Cyrix公司的单芯片电脑不会是世界上最快的电脑.
• Recent investigation shows that CeC & gt ; 2 nanoparticles can be used as CMP slurry to polish IC chip. 最新研究表明,纳米 CeO _2可用于集成电路芯片加工的化学机械抛光(CMP)浆料.
• The chip for separating luminance chrominance contributes lot to the digitized TV. 亮色分离芯片在当前的数字化电视中起着很重要的作用.
• Casuarina - chip line into the incident on a solitary tree - shaped beach to spread. 成排成片的木麻黄树循着孤形沙滩蔓延开去.
• The vacuum flask has a strong casing, which won't crack or chip. 这种热水瓶瓶身坚固，不易断裂破碎。
• To be an advancing technology in capsulation, a well developing foreground for the thermosonic flip - chip bonding. 热超声倒装键合作为前沿封装技术具有良好的发展前景.